System and method for controlling a wafer polishing process
US6623333B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 9, 2000 |
| Grant date | Sep 23, 2003 |
| Priority date | — |
| Expiry date | May 9, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67253
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method is provided for controlling a wafer polishing process. The method includes determining a polishing characteristic for a particular type of device from a set of measurements obtained from a wafer having a device of the particular type, and updating the polishing characteristic in response to polishing and measuring a wafer having a device of the particular type. The method further includes determining the polish rate of a polisher using a set of measurements obtained from a wafer polished on the polisher; and updating the polish rate of the polisher in response to polishing a wafer on the polisher and measuring the wafer. The method also includes determining a desired polishing time on the polisher for a wafer having a device of the particular type using the updated polishing characteristic of the device and the updated polish rate of the polisher.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.