Method of forming ink fill slot of ink-jet printhead
US6623335B2 · kind B2 · utility
2Cited by
12References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2001 |
| Grant date | Sep 23, 2003 |
| Priority date | — |
| Expiry date | Dec 17, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B57/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of forming an ink fill slot in a silicon substrate of an ink-jet printhead includes fluidizing abrasive particulate material with a first gas within a storage container, combining the gas fluidized abrasive particulate material with a stream of a second gas to provide a stream of the gas fluidized abrasive particulate material, and directing the stream of the gas fluidized abrasive particulate material at the silicon substrate to form the ink fill slot in the silicon substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.