Method of abrading silicon substrate
US6623338B2 · kind B2 · utility
3Cited by
12References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2001 |
| Grant date | Sep 23, 2003 |
| Priority date | — |
| Expiry date | Dec 20, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B57/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of abrading a portion of a silicon substrate includes fluidizing abrasive particulate material with a first gas within a storage container, combining the gas fluidized abrasive particulate material with a stream of a second gas to provide a stream of the gas fluidized abrasive particulate material, and directing the stream of the gas fluidized abrasive particulate material at the silicon substrate to abrade the portion of the silicon substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.