Methods, apparatus and slurries for chemical mechanical planarization
US6623355B2 · kind B2 · utility
26Cited by
41References
64Claims
0Family size
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Key dates
| Filing date | Mar 23, 2001 |
| Grant date | Sep 23, 2003 |
| Priority date | — |
| Expiry date | Nov 13, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/042
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Methods and apparatus for chemical mechanical planarization of an article such as a semiconductor wafer use polishing slurries including a carbon dioxide solvent or a carbon dioxide-philic composition. A carbon dioxide cleaning solvent step and apparatus may also be employed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.