Method for burn-in processing of optical transmitter arrays using a submount substrate
US6623997B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 15, 2000 |
| Grant date | Sep 23, 2003 |
| Priority date | — |
| Expiry date | Sep 1, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/42
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A submount substrate is used for the dual purposes of enabling simultaneous burn-in processing for a relatively large number of arrays of optical transmitters and enabling conventional dicing techniques to be used to form mounting-ready assemblies. In the preferred embodiment, the submount substrate is a silicon wafer that is specifically designed to provide connectivity between VCSEL arrays and burn-in equipment during the testing stage, but is also designed to be segmented and used in the final packaging stage. Because the submount is a silicon wafer, conventional integrated circuit fabrication techniques may be used to form conductive patterns that define array-receiving areas and that allow external circuitry to communicate with the various VCSEL arrays.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.