Low temperature heat-sealable polypropylene-based film
US6624247B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 11, 2001 |
| Grant date | Sep 23, 2003 |
| Priority date | — |
| Expiry date | Jul 11, 2021 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/04
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polypropylene-based resin film of a resin composition (C) comprising:40 to 95 wt % of a propylene-based copolymer (A) selected from a propylene random copolymer (i) of propylene with ethylene and/or &agr;-olefin and a propylene-based copolymer (ii) composed of 1 to 30 wt % of a component (a) obtained by copolymerizing propylene, an &agr;-olefin and ethylene in a first step; and 70 to 99 wt % of a component (b) obtained by copolymerizing those in the subsequent step, in which the copolymerization ratio is different from that in the first step; and5 to 60 wt % of a polypropylene-ethylene and/or &agr;-olefin block copolymer (B) having a CXS of 5.0 wt % or more, wherein the CXS has a content of ethylene and/or the &agr;-olefin of 14 to 35 mol %, and wherein the heat-seal temperature of the film of the (C) is lower by 3° C. or more than those of respective films of the (A) and (B).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.