Rubber-modified epoxy resin composition
US6624260B2 · kind B2 · utility
1Cited by
3References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 13, 2001 |
| Grant date | Sep 23, 2003 |
| Priority date | — |
| Expiry date | May 23, 2021 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L63/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
By using a curable composition comprising, (A) per 100 parts by weight of an epoxy resin, (B) from 1 to 50 parts by weight of a reactive silicon group-containing polyoxyalkylene polymer, and (C) from 1 to 90 parts by weight of a curing agent for epoxy resins, the working properties of an existing rubber-modified epoxy resin are improved to thereby give stable adhesion properties (for example, improved peel strength) without worsening the shear strength.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.