Packaged integrated circuits and methods of producing thereof

US6624505B2 · kind B2 · utility

Assignee

• SHELL CASE LIMITED · IL

Inventor

• Avner Badehi · Gdera, IL

Key dates

• Filing date: Jan 11, 2001
• Grant date: Sep 23, 2003
• Expiry date: Feb 16, 2021

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/857
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

This invention discloses a packaged integrated circuit including an integrated circuit substrate lying in a substrate plane and having electrical circuitry formed thereon, a package enclosing the integrated circuit substrate and defining first and second planar surfaces generally parallel to the substrate plane and a plurality of electrical contacts, each connected to the electrical circuitry at the substrate plane, at least some of the plurality of electrical contacts extending onto the first planar surface and at least some of the plurality of electrical contacts extending onto the second planar surface.A method for producing packaged integrated circuits is also disclosed.