Semiconductor integrated circuit device and printed wired board for mounting the same
US6624512B2 · kind B2 · utility
28Cited by
14References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 31, 2002 |
| Grant date | Sep 23, 2003 |
| Priority date | — |
| Expiry date | May 31, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor integrated circuit device and a printed wired board which self-align to each other in an exact and precise manner. The semiconductor integrated circuit device has conductive bumps. The printed wired board has conductive recessed members at positions corresponding to the conductive bumps. Each of the conductive bumps is fitted into the corresponding conductive recessed member so that the printed wired board is aligned with the semiconductor integrated circuit device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.