Solderless method for transferring high frequency, radio frequency signals between printed circuit boards
US6625881B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 20, 2002 |
| Grant date | Sep 30, 2003 |
| Priority date | — |
| Expiry date | Aug 20, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A connector system and method for cooperating printed circuit boards includes a housing member having a clip receiving slot and circuit board engaging surface that is positioned against a first printed circuit board. At least one electrically conductive clip member has opposing ends and is received within the clip receiving slot. One end is readily secured by soldering to a circuit on the first printed circuit board and the other end is biased into connection with the circuit of a second printed circuit board such that high frequency radio frequency signals are transferred from one printed circuit board to the other printed circuit board via the clip member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.