Diamond tool
US6626167B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Nov 20, 2001 |
| Grant date | Sep 30, 2003 |
| Priority date | — |
| Expiry date | Nov 20, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB28D1/121
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A segment type diamond tool, used for cutting or drilling brittle substances, such as stones, bricks, concrete structures, or asphalt structures, is disclosed. In the diamond tool, the segments are each set with diamonds in a single-layered structure or a multi-layered structure, and are alternately or intermittently arranged on a steel core, different from conventional diamond tools having segments randomly set with diamonds. Such a diamond arrangement of this invention allows the diamonds to more effectively perform their cutting action, and so the diamond tool has an increased cutting rate, in addition to reducing the amount of fine debris generated during a cutting or drilling process to ill-affect worker's health or cause environmental pollution. In the segments each set with diamonds in the single-layered or multi-layered structure, the diamond arrangement is designed such that the diamonds of each trailing segment form grooves on the surface of a brittle substance along the lands between grooves previously formed on the surface of the brittle substance by the diamonds of a leading segment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.