Heat transfer device
US6626231B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 1, 2002 |
| Grant date | Sep 30, 2003 |
| Priority date | — |
| Expiry date | Aug 1, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB64G1/506
- WIPO fieldTransport
- WIPO sectorMechanical engineering
Abstract
A heat transfer device includes a capillary-pumped first fluid loop including an evaporator situated on a satellite in the vicinity of a source of dissipated heat and a condenser connected by heat transfer members to the evaporator and situated on a deployable radiator panel of the satellite. The deployable radiator comprises at least two panels, and the heat transfer device itself further comprises at least one second capillary-pumped fluid loop. The fluid loops are connected in cascade with each other so that the evaporator of each fluid loop other than the first fluid loop is on the same panel as the condenser of the preceding loop and the condenser of each fluid loop other than the first fluid loop is on the panel next to that carrying the condenser of the first loop. The evaporator of one loop is connected to the condenser of the same loop by flexible heat transfer members.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.