Wire bonding surface
US6626680B2 · kind B2 · utility
22Cited by
23References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 24, 2001 |
| Grant date | Sep 30, 2003 |
| Priority date | — |
| Expiry date | Aug 24, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49204
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bonding pad for connecting an electrical energy storage device to an implantable medical device, is described. The bonding pad comprises at least two contact surfaces, one have a channel for receiving the terminal lead of the electrical energy storage device, the other being relatively planar for contact to the medical device. That way, the channel provides for increased surface area contact with the terminal lead for a more robust connection while the opposite, planar contact surface provides flexibility for contact to a lead of the medical device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.