Polishing method and device
US6626742B2 · kind B2 · utility
1Cited by
18References
21Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 29, 2001 |
| Grant date | Sep 30, 2003 |
| Priority date | — |
| Expiry date | Dec 28, 2021 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC03C19/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing system comprising one or more magnetic units able to produce a magnetic field is provided. The magnetic units may cause a polishing material to become plasticized and the plasticized material is able to polish a surface of a work piece. The polishing material may intermittently and repeatedly contact with the surface for polishing. A method for engraving or embossing a predefined pattern in a surface during magneto-rheological polishing of the surface is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.