Pattern release film between two laminated surfaces
US6627034B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 26, 2000 |
| Grant date | Sep 30, 2003 |
| Priority date | — |
| Expiry date | Feb 1, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1064
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of forming a laminate structure comprises providing a first substrate and a second substrate each having first and second substrate surfaces respectively, and wherein the surfaces are present in an opposed spaced apart relationship; contacting at least one of the first or second substrate surfaces with a release material such that a portion of the first or second substrate surface is covered with the release material while the remainder of the first or second substrate surface is not covered with the release material; bringing the first and second substrate surfaces of the first and second substrates into contact with each other; and subjecting the substrates to conditions such that the portions of the first and second substrate surfaces not covered with release material become bonded to one another and a laminate structure is formed. The portion of the first or second substrate surface covered with the release material allows the first and second substrates to separate from each other such that an opening is formed therebetween that is substantially coincident with the portion covered with the release material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.