Manufacture of fine-grained electroplating anodes
US6627055B2 · kind B2 · utility
0Cited by
5References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 2, 2001 |
| Grant date | Sep 30, 2003 |
| Priority date | — |
| Expiry date | Dec 14, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49991
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A continuously cast copper ingot is made by a procedure in which turbulence is imparted to the metal/solid interface during the casting operation. The ingot is then hot worked to form a billet having a smaller average grain size and a larger diameter than possible in the past. The billet is especially useful for making electroplating anodes used in the damascene process for making copper interconnects in silicon wafers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.