Fluid ejection device fabrication
US6627467B2 · kind B2 · utility
20Cited by
27References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2001 |
| Grant date | Sep 30, 2003 |
| Priority date | — |
| Expiry date | Nov 6, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/1642
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A firing chamber is formed in a fluid ejection device. The firing chamber is substantially defined by a barrier layer and a thin film stack. The barrier layer is formed over the thin film stack. The thin film stack is on a substrate and defines the bottom of the firing chamber. A sacrificial layer is encapsulated between the thin film stack and the barrier layer. The sacrificial layer is removed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.