Dielectric compositions having two steps of laminating temperatures
US6627684B2 · kind B2 · utility
0Cited by
1References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2001 |
| Grant date | Sep 30, 2003 |
| Priority date | — |
| Expiry date | Dec 18, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/066
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention discloses a dielectric composition having two steps of laminating temperatures. The composition is comprised of: a diamine curing agent containing asymmetrical chemical structures with different reactivity; an epoxy resin compound, containing at least two epoxy groups; and inorganic powder. In addition, flame retardant and toughener are added dependent on the requirements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.