Method of laser milling
US6627844B2 · kind B2 · utility
52Cited by
8References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 8, 2002 |
| Grant date | Sep 30, 2003 |
| Priority date | — |
| Expiry date | Oct 8, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/0026
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of laser milling varied shape, geometrically repeatable holes is disclosed where a laser drilling system is provided to ablate material, desired hole geometry is determined based on customer specifications, ablation rate is determined using laser drilling system parameters, and a tool path algorithm is determined based on the geometry, ablation rate, and laser drilling system parameters. The laser milling method may be used in combination with single or parallel processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.