Method and apparatus for through-body optical component attachment using laser soldering
US6627847B1 · kind B1 · utility
4Cited by
12References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2001 |
| Grant date | Sep 30, 2003 |
| Priority date | — |
| Expiry date | Dec 13, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4238
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
According to an aspect of the present invention, a method for laser soldering optical components is described. In that method, a first selected material is disposed on the components to facilitate the deposition of solder. Subsequently, solder is disposed on that material and the component is aligned. A laser beam is properly focused on the solder such that the solder melts and, when the laser beam is turned off, hardens, thereby fixing the component in the desired position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.