System and method of temperature management for semiconductor material processing
US6627860B1 · kind B1 · utility
Inventor
Key dates
| Filing date | Nov 8, 2001 |
| Grant date | Sep 30, 2003 |
| Priority date | — |
| Expiry date | Mar 6, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K15/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A heat sensing device manager system and method for processing signals from heat sensing devices used to monitor the semiconductor processing environment. The system includes a circuit for determining if a heat sensing device has failed. Where a heat sensing device has failed the system can switch control of the system such that it relies on signals generated by operational heat sensing devices. The system also provides the user with an intuitive LED interface that provides the user with information regarding the operation of the heat sensing elements of the system, and where a heat sensing device has failed the user interface can convey information regarding the nature of a particular heat sensing device failure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.