Methods and apparatus for testing a semiconductor structure using improved temperature desoak techniques
US6628132B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 10, 2001 |
| Grant date | Sep 30, 2003 |
| Priority date | — |
| Expiry date | Sep 20, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2874
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A semiconductor handling system has a temperature soak assembly to temperature soak a semiconductor structure (e.g., a panel), a test assembly to test the semiconductor structure, and a temperature desoak assembly to temperature desoak the semiconductor structure. The temperature desoak assembly includes (i) a heat sink that defines a surface which is configured to thermally couple with the semiconductor structure, (ii) a fluid guide coupled to the heat sink, and (iii) a fluid controller coupled to the fluid guide. The fluid controller provides a fluid (e.g., room temperature air) which the fluid guide directs over the heat sink to bring a temperature of the heat sink to a temperature of the fluid. This arrangement provides an effective low cost and low power means for temperature desoaking a semiconductor structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.