Method, apparatus, and system for cooling electronic components
US6628520B2 · kind B2 · utility
154Cited by
9References
34Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 6, 2002 |
| Grant date | Sep 30, 2003 |
| Priority date | — |
| Expiry date | Feb 6, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20754
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus, method, and system for cooling electronic components is disclosed. The apparatus includes liquid-to-air heat exchange equipment mounted to an enclosure for cooling the electronic components housed therein. In one embodiment the apparatus is a self-contained, stand-alone unit. In another embodiment the apparatus is connected to a remote heat exchange device. The system includes several of the apparatus arranged in parallel and is controlled to balance and optimize efficiency among the several apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.