Back to back mounted compound woofer with compression/bandpass loading
US6628792B1 · kind B1 · utility
Inventor
Key dates
| Filing date | Mar 30, 1999 |
| Grant date | Sep 30, 2003 |
| Priority date | — |
| Expiry date | Mar 30, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R1/403
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The back to back mounted compound woofer that improves sound quality by minimizing mechanical vibrations is provided. The woofer speakers of the present invention are under compression allowing for more efficient cone motion control resulting in a lower cutoff and thus, resonant, frequency. Since the compound woofer of the present invention minimizes size, material, and electrical and custom components, it is inexpensive to manufacture. A housing provides an enclosure for the compound woofer. The housing includes opposed sidewalls or side plates, each having a coaxial opening. Each of two speakers is mounted on a respective coaxial opening of a respective sidewall. Additionally, the two speakers are mounted back to back, i.e., with their magnet structures in close proximity to one another. In one embodiment, the magnet structures are coupled to one another using a flexible sealing compound such as putty. In another embodiment, the two woofers share a common unitary magnet structure. The containing volume around the speakers is made as small as physically possible by using, in one embodiment, a spiral curve member to form a substantially circular woofer housing around the woofers. T…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.