Method of manufacturing a circuit print board
US6629362B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 7, 2001 |
| Grant date | Oct 7, 2003 |
| Priority date | — |
| Expiry date | Jun 29, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/107
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention is provided to prevent a rise of temperature of a heating element and temperature of a board by inserting a graphite sheet 1 having high thermal conductivity to a circuit print board without electrically connecting with a conductive hole 6. In order to accomplish the above object, a manufacturing method of a circuit print board according the present invention has a thermal diffusive sheet forming step for forming the thermal diffusive sheet 7 by bonding resin 2 to a graphite sheet 1. Next, the method has a through hole making step for making the through hole on the thermal diffusive sheet and an insulator bonding step for forming a core 10 by thermally pressing the insulator to the thermal diffusive sheet having the through hole 3. Through these steps, the graphite sheet 1 can be inserted into the circuit print board without electrically connecting with the conductive hole 6.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.