Electrically isolated via in a multilayer ceramic package
US6629367B2 · kind B2 · utility
4Cited by
19References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 6, 2000 |
| Grant date | Oct 7, 2003 |
| Priority date | — |
| Expiry date | Dec 22, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for forming an electrically isolated via in a multilayer ceramic package and an electrical connection formed within the via are disclosed. The method includes punching a first via in a first layer, filling the first via with a cross-linkable paste, curing the paste to form an electrical insulator precursor and forming the via in the insulator precursor. The electrical connection formed includes an insulator made from a cross-linked paste supported by a substrate of a multilayer ceramic package and a conductive connection supported by the insulator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.