Method of and apparatus for making heat-sensitive stencil and heat-sensitive stencil material
US6629495B2 · kind B2 · utility
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6References
6Claims
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Key dates
| Filing date | May 17, 2001 |
| Grant date | Oct 7, 2003 |
| Priority date | — |
| Expiry date | May 29, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24331
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
When thermally perforating a thermoplastic resin film of heat-sensitive stencil material by the use of a thermal head, supply of energy to the thermal head is cut at a time the diameter of the perforations becomes not smaller than 65% and not larger than 95% of a target diameter of the perforations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.