Ink jet recording head, ink jet recording apparatus, and method for manufacturing ink jet recording head
US6629755B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 6, 2002 |
| Grant date | Oct 7, 2003 |
| Priority date | — |
| Expiry date | May 6, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/1631
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
To suitably electrically interconnect a recording element substrate, on which power supply paths are formed in a high density, and an electric wiring substrate, on which wiring lines for supplying power to these paths are formed, bumps are formed and arranged on the recording element substrate at a predetermined pitch therebetween so as to protrude by a predetermined distance t1 from this substrate. On the electric wiring substrate, on the other hand, connecting terminals are formed and arranged with the same pitch as that of the bumps. Between each two of the bumps is formed an insulating film which protrudes in the protrusion direction of the bumps by a predetermined distance t2, where t1<t2. By fitting the connecting terminals between respective pairs of the insulating films, each connecting terminal comes in contact with a corresponding bump with a sufficient contact area provided therebetween so as not to give rise to short-circuiting or open-circuiting.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.