Ink jet printheads and methods therefor
US6629756B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 20, 2001 |
| Grant date | Oct 7, 2003 |
| Priority date | — |
| Expiry date | Jun 4, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2002/14411
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
The invention provides a method for making piezoelectric printheads for ink jet The method includes applying an insulating layer to a first surface of a silicon wafer having a thickness ranging from about 200 to about 800 microns. A first conducting layer is applied to the insulating layer on the first surface and a piezoelectric layer is applied to the first conducting layer. The piezoelectric layer is patterned to provide piezoelectric elements on the first surface of the silicon wafer. A second conducting layer is applied to the piezoelectric layer and is patterned to provide conductors for applying an electric field across each of the piezoelectric elements. A photoresist layer is applied to a second surface of the silicon wafer, and the photoresist layer is imaged and developed to provide pressurizing chamber locations. The silicon wafer is then dry etched through the thickness of the wafer up to the insulating layer on the first surface of the wafer. A nozzle plate containing nozzle holes corresponding to the pressurizing chambers is applied and bonded to the second surface of the silicon wafer. As opposed to conventional wet chemical etching techniques, the method of the inv…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.