Positive sensitive resin composition and a process for forming a resist pattern therewith
US6630285B2 · kind B2 · utility
1Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 14, 1999 |
| Grant date | Oct 7, 2003 |
| Priority date | — |
| Expiry date | Oct 14, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41C2210/266
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A pattern can be precisely formed by irradiating, with an active energy beam, a positive sensitive resin composition according to this invention comprising a base polymer, an ether-bond-containing olefinic unsaturated compound and an acid-generating agent, where the base polymer is a copolymer comprising the structural units represented by formulas (1) to (3): where R1 and R3 are each independently hydrogen or methyl and R2 is C1-C6 straight or branched unsubstituted alkyl or C1-C6 straight or branched substituted alkyl,wherein a, b and c are 0.05 to 0.7, 0.15 to 0.8 and 0.01 to 0.5, respectively and a+b+c=1.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.