Thermal module with temporary heat storage
US6631755B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 17, 2002 |
| Grant date | Oct 14, 2003 |
| Priority date | — |
| Expiry date | Jul 17, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S165/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermal module with temporary heat storage. The thermal module includes a heat storage, a heat absorber, a heat dissipater, and a heat pipe for rapidly transferring heat from the heat absorber to the heat dissipater. The heat storage includes a phase change material and is in contact with the heat pipe. When heat quantities generated by the system are greater than a predefined reasonable thermal target, heat in excess of the thermal target is temporarily absorbed into the heat storage through the melting of the PCM. When the heat quantities generated by the system are again less than the thermal target, the PCM re-freezes, releasing the stored heat to be dissipated normally.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.