Copper alloy having improved stress relaxation resistance
US6632300B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 12, 2001 |
| Grant date | Oct 14, 2003 |
| Priority date | — |
| Expiry date | Aug 15, 2021 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC22F1/08
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A copper alloy having improved stress relaxation resistance is formed from a copper base alloy that consists, by weight, essentially of 1.8%-3.0% iron, 0.01%-1.0% zinc, 0.001 %-0.25% phosphorus, 0.1 %-0.35% magnesium and the balance is copper and unavoidable impurities. When compared to other copper base alloys that include iron, zinc and phosphorous, the disclosed alloy has improved resistance to stress relaxation. In addition, directionality of stress relaxation resistance (where stress relaxation resistance is typically poorer in a transverse strip direction relative to a longitudinal strip direction for a copper alloy that is strengthened by cold rolling) is reduced to being nearly equivalent, regardless of strip direction. The alloy is particularly useful for electronic applications, such as being formed into an electrical connectors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.