Method for forming a concave micro-relief in a substrate and use of said method for producing optical components
US6632375B2 · kind B2 · utility
2Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 21, 2001 |
| Grant date | Oct 14, 2003 |
| Priority date | — |
| Expiry date | Nov 10, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B5/10
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Process for the formation of at least one concave relief (124, 145) in a substrate comprising forming at least one embossment of material subject to creep (100) on the substrate (120), —heating of the material subject to creep to a temperature sufficiently high to cause creep of the said material, and—etching of the substrate and the crept material to form relief in the substrate. According to the invention, the crept material is solidified in a state in which it has a concave relief.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.