Multilayer RF amplifier module
US6633005B2 · kind B2 · utility
24Cited by
21References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 22, 2001 |
| Grant date | Oct 14, 2003 |
| Priority date | — |
| Expiry date | Oct 22, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An RF amplifier module includes PC boards laminated atop a bottom conductor plate. The boards include an RF semi-conductor amplifier chip mounted in a well extending to the bottom plate disposed in electrical connection with the chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.