Heat-dissipating devices, systems, and methods with small footprint
US6633484B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 20, 2000 |
| Grant date | Oct 14, 2003 |
| Priority date | — |
| Expiry date | Nov 20, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An enhanced heat dissipation system and a method to extract heat from an integrated circuit device include a thermally conductive core having upper and lower outer surface areas. The system further includes a first conductive ring having a first array of radially extending fins. The first conductive ring is thermally coupled to the upper outer surface area. The first array and the lower outer surface area of the thermally conductive core are of sufficient size to allow components on a motherboard to encroach around and onto the integrated circuit device when the heat dissipation device is mounted onto the integrated circuit device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.