Shielded PC card packages

US6633492B2 · kind B2 · utility

Assignee

• Methode Electronics, Inc. · US

Inventors

• Ryan Kimura · San Jose, US
• James J. Farquhar · San Jose, US
• Jeffrey Allen · Pleasanton, US
• Michael Chao · Madison, US
• Stephen McGarry Hatch · Blue Springs, US
• Scott Herbert · Pleasanton, US
• Brandt Weibezhan · San Ramon, US
• Iggoni Fajardo · Merced, US

Key dates

• Filing date: Mar 13, 2001
• Grant date: Oct 14, 2003
• Expiry date: Mar 13, 2021

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49988
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

A PCB package for shielding electromagnetic radiation from exiting or entering the package. In one embodiment the package includes first and second electrically conductive covers and first and second electrically conductive frames. The first frame electrically connected to the first cover and the second frame electrically connected to the second cover. The first frame is then electrically connected to the second frame. The first and second frames can be made of electrically conductive plastics or metals or any other electrically conductive materials. Methods of assembling the packages of the various embodiments are also set forth.