Opto-electronic multi-chip modules using imaging fiber bundles
US6633710B2 · kind B2 · utility
2Cited by
10References
18Claims
0Family size
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Key dates
| Filing date | Jun 18, 2001 |
| Grant date | Oct 14, 2003 |
| Priority date | — |
| Expiry date | Jun 23, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4249
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Multipath structures formed from coherent fiber bundle structures for interconnecting a number of opto-electronic devices in a compact space. The coherent fiber bundle structures are formed from fiber optic plates and have different geometries and fiber orientations in order to transmit optic signal between opto-electronic device in different locations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.