Solder ball delivery and reflow method
US6634545B2 · kind B2 · utility
15Cited by
53References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 7, 2001 |
| Grant date | Oct 21, 2003 |
| Priority date | — |
| Expiry date | Nov 7, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3478
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus and method for high speed, reliable and repeatable delivery and reflow of solder material onto a substrate are disclosed. The apparatus has a repositionable capillary to direct individual solder material to a specific location on the substrate. An energy source is directed through the capillary onto the solder to reflow the solder to the substrate. The apparatus provides for individual introduction of the solder material into the capillary and urging of the solder material from a reservoir to the capillary while preventing unintended jams and blockage of the solder material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.