Smart card having additional connector pads
US6634565B2 · kind B2 · utility
16Cited by
5References
3Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 6, 2001 |
| Grant date | Oct 21, 2003 |
| Priority date | — |
| Expiry date | Nov 6, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48227
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A smart card, having a set of standardized contact pads and an additional set of contact pads to provide additional performance characteristics. The additional contact pads are formed on the smart card on the area located between the ISO 7816 standardized contact pads C1 through C4 and C5 through C8, which area was previously used solely as a ground plane connection to contact pad C5. By increasing the number of contact pads, the additional pads can be used for input/output connections, memory, flash memory and/or interfaces with specific functions such as a service provided interface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.