Spring-loaded heat sink assembly for a circuit assembly
US6634890B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 8, 2001 |
| Grant date | Oct 21, 2003 |
| Priority date | — |
| Expiry date | Nov 3, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/365
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A spring-loaded heat sink assembly for a circuit assembly, an installation tool, and a method of installation. The assembly comprises a heat sink, a load plate, and at least one leaf spring positioned therebetween. The load plate comprises elongate shafts having an open channel therethrough which extend through the leaf spring(s) and heat sink and at least partially through the circuit assembly. The elongate shafts provide a space for the leaf spring(s) between the heat sink and load plate. Fasteners extend through the elongate shafts to connect the spring-loaded heat sink assembly to the circuit assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.