Patent · US Expired

Spring-loaded heat sink assembly for a circuit assembly

US6634890B2 · kind B2 · utility

20Cited by
3References
10Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 8, 2001
Grant dateOct 21, 2003
Priority date
Expiry dateNov 3, 2021

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K3/365
  • WIPO fieldAudio-visual technology
  • WIPO sectorElectrical engineering

Abstract

A spring-loaded heat sink assembly for a circuit assembly, an installation tool, and a method of installation. The assembly comprises a heat sink, a load plate, and at least one leaf spring positioned therebetween. The load plate comprises elongate shafts having an open channel therethrough which extend through the leaf spring(s) and heat sink and at least partially through the circuit assembly. The elongate shafts provide a space for the leaf spring(s) between the heat sink and load plate. Fasteners extend through the elongate shafts to connect the spring-loaded heat sink assembly to the circuit assembly.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.