Aqueous nonferrous feedstock material for injection molding
US6635099B2 · kind B2 · utility
2Cited by
9References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 24, 2001 |
| Grant date | Oct 21, 2003 |
| Priority date | — |
| Expiry date | Jan 24, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
This invention provides a process for forming sintered, molded articles having improved dimensional stability. More particularly, this invention pertains to process for forming heat sinks. This process includes forming a substantially uniform copper composition comprising a polysaccharide binder, water, and copper particles; molding the copper composition under conditions sufficient to form a solid molded intermediate; and sintering the solid molded intermediate at a sufficient temperature and for a sufficient time to form a heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.