Form-in place EMI gaskets
US6635354B2 · kind B2 · utility
18Cited by
47References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 12, 2001 |
| Grant date | Oct 21, 2003 |
| Priority date | — |
| Expiry date | Sep 12, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31699
- WIPO fieldMechanical elements
- WIPO sectorMechanical engineering
Abstract
A form-in-place, electrically-conductive gasket is disclosed. The gasket, foamed, gelled or unfoamed is made of one or more elastomer resins, such as silicone urethane and/or thermoplastic block copolymers and is either filled with a conductive filler and lined onto a desired substrate or lined onto the substrate unfilled and then coated with a conductive outer layer, such as a silver filled elastomer or a conductive flocked layer. A process and system for making the gaskets are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.