Integrated ball grid array-pin grid array-flex circuit interposing probe assembly
US6635511B2 · kind B2 · utility
0Cited by
2References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 18, 2001 |
| Grant date | Oct 21, 2003 |
| Priority date | — |
| Expiry date | Jul 15, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3447
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The method of the invention comprises the steps of soldering a BGA socket onto a PGA header, inserting a flex assembly onto the BGA-PGA assembly, placing solder preforms over the PGA pins and then reflowing the flex assembly to the BGA-PGA assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.