Temperature control device for an electronic component
US6636062B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 10, 2001 |
| Grant date | Oct 21, 2003 |
| Priority date | — |
| Expiry date | Apr 10, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/0458
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A combined heater and heat sink assembly regulates the temperature of a device under test. The combined heating/cooling assembly includes a heater assembly inlay that is received within a heat sink. The heater assembly includes a heating surface that is coplanar with a cooling surface of the heat sink. In operation, the heating/cooling assembly provides concurrent hot and cold contact points for the device under test. The heater assembly is thermally insulated from the heat sink such that the majority of the heat generated by the heater assembly is directly applied to the device under test; very little of the generated heat is lost to the heat sink. On the other hand, the heat sink provides a relatively low thermal resistance between the device under test and a cold source such as a coolant. Accordingly, the combined heating/cooling assembly provides parallel thermal paths between the device under test and both a hot source and a cold source.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.