Integrated ball grid array-pin grid array-flex laminate test assembly
US6638080B2 · kind B2 · utility
3Cited by
6References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 18, 2001 |
| Grant date | Oct 28, 2003 |
| Priority date | — |
| Expiry date | Jan 18, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0415
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An integrated probe assembly provides the capability to test integrated circuit (IC) packages mounted onto ball grid arrays. The present invention comprises an unsealed BGA socket (102), nail head pins (107) which can be inserted flush into a pin carrier to produce a PGA header (103), a Flex circuit assembly comprising a piece of flexible circuit (104) with various passive resistors and connectors attached and solder preforms (113) used to solder the flex assembly to the pin grid array. Matched impedance connectors (105) are attached at an end of the flexible circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.