Polishing instrument
US6638151B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 9, 2001 |
| Grant date | Oct 28, 2003 |
| Priority date | — |
| Expiry date | Oct 29, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D13/14
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention relates to a polishing instrument for polishing a surface into a predetermined configuration. The present invention aims to provide a polishing instrument superior in operability and stability and capable of polishing a surface into a desired configuration. The polishing instrument of the present invention includes: a rotatable rotary substrate portion equipped with a polishing plane holding a polishing material on its surface; a plurality of movable substrate portions equipped with polishing planes which hold the polishing material on their surfaces, which are provided in the peripheral edge of the rotary substrate portion, and which rotate about a connection line connecting them to the rotary substrate portion; and elastic members for biasing the polishing planes of the movable substrate portions toward a position where they are flush with the polishing plane of the rotary substrate portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.