Hole metal-filling method
US6638858B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 30, 2001 |
| Grant date | Oct 28, 2003 |
| Priority date | — |
| Expiry date | Feb 7, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10234
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A hole metal-filling method, applied to hole filling and electroplating a printed circuit board which has been mechanical-drilled with holes. A plurality of holes is drilled in a substrate. The substrate is placed on a platform. A plurality of metal balls is disposed on a surface of the substrate. By vibrating the platform, a part of the metal balls roll into the holes, while the metal balls not rolling into the holes are removed. The substrate is then placed on a press down unit. The metal balls in the holes are pressed to level with surfaces of the substrate. The substrate is directly electroplated for forming a plating layer closely dovetail to the metal balls.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.