Method and system for processing one or more microstructures of a multi-material device
US6639177B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2002 |
| Grant date | Oct 28, 2003 |
| Priority date | — |
| Expiry date | Apr 10, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/0026
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and system for processing at least one microstructure which is part of a multi-material device containing a plurality of microstructures is provided. The at least one microstructure has a designated region for target material removal. The method includes generating a laser beam, modifying the laser beam to obtain a modified laser beam, and sequentially and relatively positioning the modified laser beam into at least one non-round spot having a predetermined non-round energy distribution on the designated region to remove the target material in the designated region. The predetermined non-round energy distribution covers an area of the designated region such that energy is more efficiently coupled into the designated region for the non-round energy distribution than energy coupled into the designated region for a round energy distribution covering the same area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.