Apparatus for producing microbore holes

US6639179B2 · kind B2 · utility

Assignee

• Heidelberg Instruments Mikrotechnik GMBH · DE

Inventors

• Sven Vogler · Heidelberg, DE
• Roland Kaplan · Heidelberg, DE

Key dates

• Filing date: Jan 23, 2002
• Grant date: Oct 28, 2003
• Expiry date: Jan 23, 2022

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K3/0026
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A method of producing microbore holes in a multi-layer substrate (5), preferably a printed circuit board substrate, that is displaced below writing optics (4) by an XY stage (6), using the optics to generate a spot from a light source (1), preferably a laser. The method reduces the treatment time and preferably compensates for distortions in the substrate material. To this end, the position of the spot within a working field is changed simultaneously with the treatment positions by electronically controlled, movable mirrors. The position of the substrate is determined by an interferometer (9, 11), and the signals corresponding to the substrate position are processed by a suitable computer system (16) to obtain an actual position of the table system. The computer system (16) is preferably provided with all bore hole coordinates and additional information such as bore hole diameter, especially in tabular form.