Computer heat sink
US6640883B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 14, 2002 |
| Grant date | Nov 4, 2003 |
| Priority date | — |
| Expiry date | Feb 14, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A computer heat sink, it especially suits heat sinking of various chip sets or processors which may generate high temperature during running, and has the effect of better efficiency of heat sinking and inexpensiveness of production. It includes many heat sinking fins on the periphery of a base which has centrally a receiving space for fixing a fan, when the air flow generated during running of the fan passes through the gaps among the fins, heat exchanging is induced between the air and the fins to effect heat sinking, The heat sink is characterized by that, each of a plurality of mutually neighboring pairs of heat sinking fins have a difference in the distances of their tops from the center of the base to thereby enlarge the gap therebetween, a peripheral top edge of each heat sinking fin and a line orthogonal to a diametrical line of the base extending through the heat sinking fin have therebetween an included slant angle denoting horizontal slanting of the heat sinking fin, thereby, air flowing through the gaps flows fast by guiding of the included slant angles, and the efficiency of heat sinking is increased.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.